Nokia and Intel Team for Wireless Broadband

Nokia and Intel have announced a deal to make HSDPA wireless broadband modules from Nokia an embedded option in Intel's Centrino Duo mobile technology.

Finland’s Nokia had announced a partnership with chip-marker Intel which will make a Nokia-developed HSDPA (High Speed Downlink Packet Access) connectivity module an embedded option in Intel’s Centrino Duo mobile technology platform. Under the deal, INtel will handle designing the platform and its software, as well as oversee the HDSPA module integration and offer support, sales, and marketing. Nokia brings its 3G wireless networking know-how to the table, as well as the wireless broadband module itself.

Embedding HSDPA cellular connectivity in notebook computers will enable users to choose between connectivity options when they’re on the move, optionally connecting through available Wi-Fi networks or through cellular-based 3G mobile phone networks.

"This collaboration is good news for notebook users as cellular technology offers superior connectivity and mobility for notebook and other portable device users. This is also a natural area for Nokia’s multiradio expertise to expand to," said Heikki Tenhunen, head of Nokia’s Connectivity Module Business Program. "An important aspect in bringing an HSDPA connectivity module to notebooks is the fact that 3G is the fast wireless broadband technology which is available for consumers today in a large number of countries in different continents. We believe that 3G connectivity will develop to a strong wireless wide area network mobile connectivity option for notebook computers."

Expect Nokia’s HSDPA solution to be offered alongside Intel’s exiting Wi-Fi and WiMAX offerings for notebook users.