Tag archive: Elpida Memory

The device surpassed the maximum speed currently available for high-end server applications — the DDR2-667 specification which is currently under consideration by JEDEC. The device uses high-performance transistors with 100 nm process technology, and also has an optimized layout design that reduces speed bottlenecks on the signal and data paths in the memory array and peripherals — this allows for 800 Mbps operation even in a… Read More

Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it will begin mass production of DDR2 SDRAM using advanced 0.10-micron process technology in August 2004.Elpida Memory's first products slated for manufacturing utilizing 0.10-micron process technology include high-performance, high-density DRAM products such as DDR2-533 and DDR2-667. “Elpida strives to offer the industry stable… Read More

From Elpida's press release: Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it now offers an expanded line of 0.11-micron, high-speed consumer DRAM devices for use in digital consumer applications. The devices are offered in 64 Megabit, 128 Megabit and 256 Megabit densities with 16-bit and 32-bit organizations and are available in TSOP, FBGA and… Read More

From Elpida's press release: Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has shipped the first 1 Gigabyte DDR2 small-outline dual in-line memory module (SO-DIMM) that brings low-power, high-density, high-performance and small form-factor benefits to notebook PC applications. Separately, Elpida has also shipped samples of its 256 Megabit DDR2 SDRAM… Read More

From Elpida's news release: The 2 Gigabyte modules are the highest density available for the server market, and they offer high-speed performance with a data transfer rate of 4.3 Gigabytes per second (PC2-4300). Elpida's newly developed stacked BGA (sBGA) technology creates a slim module (4.8 millimeter thickness) that increases air flow space between modules, thus improving thermal performance and reliability for server… Read More

Elpida Memory plans to use the proceeds from this proposed investment and other intended financing to significantly boost production at its 300-mm, sub-0.11 micron DRAM wafer fabrication plant in Hiroshima, Japan. Assuming timely satisfaction of all closing conditions, including satisfactory completion of due diligence, receipt of necessary internal and regulatory approvals and achievement of a substantial additional funding amount from… Read More