Digital Trends
The worldwide economy might be in a sharp downturn, but chipmaker Intel is still looking to the future, announcing today it plans to invest $7 billion in its U.S. manufacturing facilities over the next two years. The most will roll out the company’s 32-nanometer technology to more facilities, enabling the company to produce more processors and semiconductor products that are smaller, faster, and use less energy.
According to reports in The Wall Street Journal and elsewhere, computer maker Dell may be looking to sell some or all of its computer manufacturing factories around the world to contract computer makers, in a bid to improve its bottom line. The Journal quotes one source briefed on the plan that dell may sell most or all of its manufacturing facilities within the next year and a half.
Taiwan’s Asustek, a leading PC manufacturer and well-known contract manufacturer of both PCs and consumer electronics, has announced that it will split itself into three companies in a move to separate its own brand-name business from its contract manufacturing businesses. “We think this will boost our competitiveness in each area,” said Asustek chairman Jonney Shih at a news event in Taipei.
Under the proposed split, Asustek would carry on the company’s brand manufacturing, including the company’s well-regarded (if occasionally over-flashy) Asus notebook and desktop computer lines. The company will spin off its contract PC manufacturing operations into a new company called Unihan Technology Corp., while its non-PC manufacturing activities (including casings) will be handled by the new Pegatron Technology Corporation.
From AMD’s press release:
AMD announced today that it is achieving a smooth transition to 90 nanometer (nm) manufacturing and has shipped low-power 90nm Mobile AMD Athlon 64 processors for thin and light notebooks (previously codenamed “Oakvilleâ€) for revenue. Manufacturers are expected to launch systems based on the new 90nm Mobile AMD Athlon 64 processors in the coming months.
In addition to providing performance and power benefits to AMD64 products today, the transition keeps AMD on track with its plans to deliver 90nm dual-core products mid-next year and also provides operational benefits such as increased production capacities.
From VIA’s press release:
VIA Technologies, Inc, and Yamashita System, Co. Ltd. today announced the AS-1210, the world’s first lead-free mainboard based on the award winning VIA Eden Platform.
A leading proponent of “Green Computing”, VIA continues to spearhead the drive for environmentally friendly computing by emphasizing power efficiency and ergonomics, and through the early adoption of manufacturing processes that exclude hazardous substances such as lead. VIA’s move to lead-free manufacturing started in 2001 with the introduction of the Enhanced Ball Grid Array (EBGA) package featured on power efficient VIA processors, and the Heat Sink Ball Grid Array (HSBGA) package for its market leading chipsets.
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