The quote echoes a similar statement from LG, whose head of mobile product said the Snapdragon 810 inside the forthcoming G Flex 2 smartphone was not only working perfectly but running cooler than other processors.
However, one company out there doesn’t share LG’s optimism, or Qualcomm’s insistence that all is well with the Snapdragon 810. Hidden inside Qualcomm’s most recent financial report, released at the end of January, the firm lowered its outlook for the coming months, due in part to, “expectations the Snapdragon 810 processor will not be in the upcoming design cycle of a large customer’s flagship device.”
No names were mentioned, but this fits in with long-running rumors Samsung won’t be putting the Snapdragon 810 inside the Galaxy S6, expected to launch at Mobile World Congress in March. Samsung may have finalized plans to use its own Exynos chip inside the phone instead. While the 810’s alleged thermal problems are often linked with Samsung, reports of similar issues have plagued the processor since late last year.
LG’s G Flex 2 will be out in the coming weeks, and is likely to be our first chance to see the Snapdragon 810 in action. However, the rumored HTC One M9, and the Xperia Z4 are also expected to use the chip, and could arrive at a similar time. Chinese manufacturer Xiaomi has also announced the processor will power its Mi Note Pro, which has yet to have a final release date.
Editors' Recommendations
- MediaTek gives mmWave 5G a boost with Dimensity 1050 chip
- Realme GT 2 Pro lets you unravel wonders of the micro world
- Camera shootout: Samsung Galaxy S22 vs. OnePlus 10 Pro
- Here are Qualcomm’s latest processors and new AR glasses
- Moto G 5G hands-on review: Good phone, better battery
