IBM, Samsung, and Charted Semiconductor have expanded a pact to jointly develop and manufacture chips using 32 nanometer process technologies. The deal also pulls in Freescale Semiconductor, which recently buddied up with IBM after NXP Semiconductors pulled out of a similar manufacturing group dubbed the Crolles Alliance. Without NXP, the Crolles Alliance partners had no clear path to progress beyond current 45-nanometer chip technologies. Infineon Technologies is also a partner in the venture.
The deal extends through the year 2010, and applies to processors designed to be used in everything from mobile phones to supercomputers. The IBM alliance started out working at the 90 nm level, and then moved to 65 nm and 45 nm. industry watchers and engineers expect major challenges at the 32 nm level, prompting the need for R&D and manufacturing alliances to work out the problems. Historically, chip developers have formed consortiums to spread the substantial costs of chip design and process development.
“Major new challenges are expected at the 32nm node, both in materials as well as device structures,” said Dr. Oh-Hyun Kwon, president of Samsung Semiconductor Business’ System LSI Division. “We expect to deliver breakthrough technology by working together with our partners, who bring a variety of expertise as leaders in the industry.”
As with previous technologies handled by the alliance, 32nm development will take place at IBM’s 300mm semiconductor fab in East Fishkill, New York.
